Different indoor LED display screens differ from each other based on many factors. One key factor is the packaging methods used. Generally, three common packaging methods are widely used in the LED display industry, including surface mount (SMD), COB, and flip chip COB.

SMD is still mainstream. It helps significantly reduce the dot pitch of LED displays and is cost-effective. The technology is complete, and there isn’t much room for improvement. Because of this, COB, specifically the flip chip COB LED, is quickly becoming the future trend.

Recent developments in LED packaging technologies have revealed the various advantages of COB and flip chip COB LEDs. COB refers to Chip on Board technology. In this packaging method, multiple LED chips are put on top of each other and attached directly to the substrate. It simplifies the packaging structure to improve the stability and performance of the final display.

 

Flip chip COB is the upgraded version of COB. As compared to the COB, flip chip COB chips are first connected with a bump and then flipped over to connect with the substrate. In this way, they improve the already great advantages of COB LEDs and promote better reliability, excellent near-screen experience, better overall display effect, a more simplified production process, true chip-level spacing, excellent RGB lighting effect, and more.

Even though flip chip technology has recently entered the indoor LED display market, it is already proving to be the revolutionary tech that the industry needs to fulfill the increasing demands of consumers.

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Consumer Demands for Displays

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Consumers’ requirements for LED displays have become more stringent with time. These days, consumers want displays that feature improved visual quality, better viewing angles, a better near-screen experience, and anti-glare capability with higher brightness and contrast levels. Conference LED screens featuring SMD packaging cannot fulfill all these requirements. That’s why flip chip COB LED is becoming so popular.

· Chip-Level Spacing: Since flip chip LED doesn’t require wire bonding, it can achieve true chip-level spacing (the level of Micro LED) and overcome the obstacles faced by conventional COB packaging.

· High Pixel Density: Flip chip LED features wireless bonding, and the space size only hinges on the size of the chip, leading to much higher pixel density.

· High Brightness and Contrast: Flip chip COB LED has a larger light-emitting area which results in better contrast, higher brightness, and a darker black field.